Three Dimensional Integrated Circuits

33 books
Three-dimensional integrated circuit designVasilis F. Pavlidis
⏱ 8h 59m

Three-dimensional integrated circuit design

Vasilis F. Pavlidis

2009539 pp.
Three-dimensional integrated circuit layoutAndrew Harter
⏱ 3h 27m

Three-dimensional integrated circuit layout

Andrew Harter

1991207 pp.
Design of 3D Integrated Circuits and SystemsRohit Sharma
⏱ 5h 24m

Design of 3D Integrated Circuits and Systems

Rohit Sharma

2014324 pp.
Design and Modeling for 3D ICs and InterposersMadhavan Swaminathan

Design and Modeling for 3D ICs and Interposers

Madhavan Swaminathan

2013No page data
Vertical 3D Memory TechnologiesBetty Prince
⏱ 6h 8m

Vertical 3D Memory Technologies

Betty Prince

2014368 pp.
Physical Design for 3D Integrated CircuitsAida Todri-Sanial
⏱ 6h 37m

Physical Design for 3D Integrated Circuits

Aida Todri-Sanial

2015397 pp.
Shirikon kantsū denkyoku TSVSeiichi Denda
⏱ 3h 57m

Shirikon kantsū denkyoku TSV

Seiichi Denda

2011237 pp.
Through Silicon ViasBrajesh Kumar Kaushik
⏱ 3h 36m

Through Silicon Vias

Brajesh Kumar Kaushik

2016216 pp.
3D Integration in VLSI CircuitsKatsuyuki Sakuma
⏱ 3h 37m

3D Integration in VLSI Circuits

Katsuyuki Sakuma

2018217 pp.
Stress Induced Phenomena and Reliability in 3D MicroelectronicsJapan) International Workshop on Stress-Induced Phenomena in Microelectronics (12th 2012 Kyoto
⏱ 3h 5m

Stress Induced Phenomena and Reliability in 3D Microelectronics

Japan) International Workshop on Stress-Induced Phenomena in Microelectronics (12th 2012 Kyoto

2014185 pp.
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects EntanglementYue Ma
⏱ 3h 46m

Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement

Yue Ma

2019226 pp.
Handbook of 3D integrationPeter Ramm

Handbook of 3D integration

Peter Ramm

2008No page data
Throughsilicon Vias For 3d IntegrationJohn Lau

Throughsilicon Vias For 3d Integration

John Lau

2012No page data
3D IC Integration and PackagingJohn Lau
⏱ 8h 0m

3D IC Integration and Packaging

John Lau

2015480 pp.
Semiconducting Black PhosphorusHan Zhang
⏱ 4h 0m

Semiconducting Black Phosphorus

Han Zhang

2021240 pp.
3-jigen shisutemu in pakkēji to zairyō gijutsuTadatomo Suga
⏱ 4h 54m

3-jigen shisutemu in pakkēji to zairyō gijutsu

Tadatomo Suga

2012294 pp.
3D Process TechnologyPhilip Garrou
⏱ 7h 54m

3D Process Technology

Philip Garrou

2014474 pp.
Design For High Performance Low Power And Reliable 3d Integrated CircuitsSung Kyu Lim

Design For High Performance Low Power And Reliable 3d Integrated Circuits

Sung Kyu Lim

2012No page data
3D Integration for VLSI SystemsSteven Koester

3D Integration for VLSI Systems

Steven Koester

2011No page data
3D IC stacking technologyBanqiu Wu
⏱ 8h 41m

3D IC stacking technology

Banqiu Wu

2011521 pp.
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