Semiconductor Wafers

114 books

Techniques and challenges for 300 mm siliconSymposium F on Techniques and Challenges for 300 mm Silicon (1998 Strasbourg, France)

⏱ 3h 26m

Techniques and challenges for 300 mm silicon

Symposium F on Techniques and Challenges for 300 mm Silicon (1998 Strasbourg, France)

1999206 pp.

Semiconductor wafer bondingQ.-Y Tong

⏱ 5h 9m

Semiconductor wafer bonding

Q.-Y Tong

1998309 pp.

Semiconductor measurement technologyW. Murray Bullis

⏱ 3h 31m

Semiconductor measurement technology

W. Murray Bullis

1993211 pp.

Cleaning technology in semiconductor device manufacturingUnknown Author

⏱ 6h 14m

Cleaning technology in semiconductor device manufacturing

Unknown Author

2002374 pp.

Chō daikōkei shirikon wēha no chō seimitsu keijō sokutei, hyōka gijutsu no kenkyūShinkinzoku Kyōkai

Chō daikōkei shirikon wēha no chō seimitsu keijō sokutei, hyōka gijutsu no kenkyū

Shinkinzoku Kyōkai

2000No page data

A wafer chuck for use between -196 and 350C̊R. Y. Koyama

A wafer chuck for use between -196 and 350C̊

R. Y. Koyama

1979No page data

The Automated semiconductor wafer fabrication market in EuropeFrost & Sullivan

⏱ 5h 0m

The Automated semiconductor wafer fabrication market in Europe

Frost & Sullivan

1986300 pp.

Proceedings of the Third International Symposium on Semiconductor Wafer BondingInternational Symposium on Semiconductor Wafer Bonding (3rd 1995 Reno, Nevada)

⏱ 10h 10m

Proceedings of the Third International Symposium on Semiconductor Wafer Bonding

International Symposium on Semiconductor Wafer Bonding (3rd 1995 Reno, Nevada)

1995610 pp.

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and ApplicationsInternational Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (2nd 1993 Honolulu, Hawaii)

⏱ 8h 5m

Proceedings of the Second International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (2nd 1993 Honolulu, Hawaii)

1993485 pp.

Wafer bondingU. Gösele

⏱ 8h 19m

Wafer bonding

U. Gösele

2004499 pp.

Wafer fabricationLinda F. Atherton

⏱ 7h 48m

Wafer fabrication

Linda F. Atherton

1995468 pp.

National security assessment of the U.S. semiconductor wafer processing equipment industryUnited States. Dept. of Commerce. Office of Industrial Resource Administration. Strategic Analysis Division.

National security assessment of the U.S. semiconductor wafer processing equipment industry

United States. Dept. of Commerce. Office of Industrial Resource Administration. Strategic Analysis Division.

1991No page data

Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and ApplicationsInternational Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (1st 1991 Phoenix, Ariz.)

⏱ 8h 18m

Proceedings of the First International Symposium on Semiconductor Wafer Bonding--Science, Technology, and Applications

International Symposium on Semiconductor Wafer Bonding: Science, Technology, and Applications (1st 1991 Phoenix, Ariz.)

1992498 pp.

1996 1st International Symposium on Plasma Process-Induced DamageInternational Symposium on Plasma Process-Induced Damage (1st 1996 Santa Clara, Calif.)

⏱ 3h 57m

1996 1st International Symposium on Plasma Process-Induced Damage

International Symposium on Plasma Process-Induced Damage (1st 1996 Santa Clara, Calif.)

1996237 pp.

Wafer engineeringFrost & Sullivan

⏱ 3h 6m

Wafer engineering

Frost & Sullivan

1990186 pp.

Semiconductor capital equipment--profiles 1999Jim Griffin

Semiconductor capital equipment--profiles 1999

Jim Griffin

1999No page data

The U.S. semiconductor wafer processing equipment marketUnknown Author

⏱ 5h 6m

The U.S. semiconductor wafer processing equipment market

Unknown Author

1989306 pp.

Cleaning Technology in Semiconductor Device ManufacturingRichard E. Novak

⏱ 10h 14m

Cleaning Technology in Semiconductor Device Manufacturing

Richard E. Novak

2001614 pp.

Cleaning technology in semiconductor device manufacturing VIIIUnknown Author

⏱ 7h 16m

Cleaning technology in semiconductor device manufacturing VIII

Unknown Author

2004436 pp.

Cleaning technology in semiconductor device manufacturing IXJerzy Rużyłło

⏱ 6h 19m

Cleaning technology in semiconductor device manufacturing IX

Jerzy Rużyłło

2005379 pp.

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