Multichip Modules Microelectronics

68 books
EuPac '94European Conference on Electronic Packaging Technology (1st 1994 Essen, Germany)
⏱ 4h 24m

EuPac '94

European Conference on Electronic Packaging Technology (1st 1994 Essen, Germany)

1994264 pp.
Thermal management handbookJerry E. Sergent

Thermal management handbook

Jerry E. Sergent

1998No page data
Introduction to system-on-package (SOP)Rao R. Tummala
⏱ 13h 5m

Introduction to system-on-package (SOP)

Rao R. Tummala

2008785 pp.
System-in-packageTechSearch International
⏱ 2h 30m

System-in-package

TechSearch International

2005150 pp.
Sensing, modeling, and simulation in emerging electronic packagingCharles Ume
⏱ 2h 5m

Sensing, modeling, and simulation in emerging electronic packaging

Charles Ume

1996125 pp.
1997 International Symposium on MicroelectronicsInternational Symposium on Microelectronics (1997 Philadelphia, Pennsylvania)
⏱ 11h 47m

1997 International Symposium on Microelectronics

International Symposium on Microelectronics (1997 Philadelphia, Pennsylvania)

1997707 pp.
1996 International Symposium on MicroelectronicsInternational Symposium on Microelectronics (1996 Minneapolis, Minnesota)
⏱ 10h 10m

1996 International Symposium on Microelectronics

International Symposium on Microelectronics (1996 Minneapolis, Minnesota)

1996610 pp.
Roadmaps of packaging technologyEric Bogatin

Roadmaps of packaging technology

Eric Bogatin

1997No page data
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesJohn H. Lau
⏱ 9h 45m

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

2000585 pp.
Application of fracture mechanics in electronic packagingWilliam T. Chen
⏱ 3h 17m

Application of fracture mechanics in electronic packaging

William T. Chen

1997197 pp.
Proceedings 1999 International Symposium on MicroelectronicsInternational Symposium on Microelectronics (1999 Chicago, Ill.)
⏱ 13h 36m

Proceedings 1999 International Symposium on Microelectronics

International Symposium on Microelectronics (1999 Chicago, Ill.)

1999816 pp.
MCM C/mixed technologies and thick film sensorsNATO Advanced Research Institute on Ceramic/Mixed Mode Multi-Chip Modules (MCM) (1994 Islamorada, Fla.)
⏱ 5h 23m

MCM C/mixed technologies and thick film sensors

NATO Advanced Research Institute on Ceramic/Mixed Mode Multi-Chip Modules (MCM) (1994 Islamorada, Fla.)

1995323 pp.
Multichip modulesRobert K. F. Teng
⏱ 10h 30m

Multichip modules

Robert K. F. Teng

1991630 pp.
Critical review and technology assessments '91-'92Reliability Analysis Center (U.S.)

Critical review and technology assessments '91-'92

Reliability Analysis Center (U.S.)

1992No page data
Advanced electronic packagingUnknown Author
⏱ 13h 9m

Advanced electronic packaging

Unknown Author

1999789 pp.
Thirteenth IEEE/CHMT International Electronics Manufacturing Technology SymposiumIEEE/CHMT International Electronics Manufacturing Technology Symposium (13th 1992 Baltimore, Md.)
⏱ 6h 21m

Thirteenth IEEE/CHMT International Electronics Manufacturing Technology Symposium

IEEE/CHMT International Electronics Manufacturing Technology Symposium (13th 1992 Baltimore, Md.)

1992381 pp.
System design using high density packaging and multi chip modulesEtienne Hirt
⏱ 3h 8m

System design using high density packaging and multi chip modules

Etienne Hirt

2000188 pp.
Physical design for multichip modulesM. Sriram
⏱ 3h 17m

Physical design for multichip modules

M. Sriram

1994197 pp.
Ball grid array & fine pitch peripheral interconnectionsJennie S. Hwang
⏱ 4h 1m

Ball grid array & fine pitch peripheral interconnections

Jennie S. Hwang

1995241 pp.
Multichip packaging and bare chip systemsBrent J. Knipfer
⏱ 4h 17m

Multichip packaging and bare chip systems

Brent J. Knipfer

1994257 pp.
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