Microelectronic Packaging

264 books
MEMS and MicrosystemsTai-Ran Hsu
⏱ 7h 28m

MEMS and Microsystems

Tai-Ran Hsu

2001448 pp.
Physical Design EssentialsKhosrow Golshan
⏱ 3h 42m

Physical Design Essentials

Khosrow Golshan

2007222 pp.
Practical Guide to the Packaging of ElectronicsAli Jamnia
⏱ 5h 42m

Practical Guide to the Packaging of Electronics

Ali Jamnia

2002342 pp.
Soldering in electronicsR. J. Klein Wassink
⏱ 12h 33m

Soldering in electronics

R. J. Klein Wassink

1984753 pp.
Introduction to microsystem packaging technologyYufeng Jin
⏱ 3h 52m

Introduction to microsystem packaging technology

Yufeng Jin

2010232 pp.
Microelectronics packaging handbookR.R. Tummala
⏱ 12h 32m

Microelectronics packaging handbook

R.R. Tummala

1997752 pp.
Advanced electronic packagingRichard K. Ulrich
⏱ 13h 46m

Advanced electronic packaging

Richard K. Ulrich

2006826 pp.
Area Array Packaging ProcessesKen Gilleo
⏱ 4h 19m

Area Array Packaging Processes

Ken Gilleo

2003259 pp.
Semiconductor packagingAndrea Chen
⏱ 3h 36m

Semiconductor packaging

Andrea Chen

2011216 pp.
Area Array Packaging HandbookKen Gilleo
⏱ 16h 40m

Area Array Packaging Handbook

Ken Gilleo

20011000 pp.
Microelectronic packaging and laser processingRay T. Chen
⏱ 3h 50m

Microelectronic packaging and laser processing

Ray T. Chen

1997230 pp.
Fundamentals of microsystems packagingRao R. Tummala
⏱ 16h 7m

Fundamentals of microsystems packaging

Rao R. Tummala

2001967 pp.
Montazh mikroėlektronnoĭ apparaturyG. I͡A Gusʹkov
⏱ 2h 54m

Montazh mikroėlektronnoĭ apparatury

G. I͡A Gusʹkov

1986174 pp.
1995 International Conference on Multichip ModulesInternational Conference and Exhibition on Multichip Modules (4th 1995 Denver, Colo.)
⏱ 9h 32m

1995 International Conference on Multichip Modules

International Conference and Exhibition on Multichip Modules (4th 1995 Denver, Colo.)

1995572 pp.
ProceedingsInternational Conference and Exhibition on Multichip Modules (6th 1997 Denver, Colo.)
⏱ 6h 19m

Proceedings

International Conference and Exhibition on Multichip Modules (6th 1997 Denver, Colo.)

1997379 pp.
1996 International Conference on Multichip ModulesInternational Conference and Exhibition on Multichip Modules (5th 1996 Denver, Colo.)
⏱ 7h 2m

1996 International Conference on Multichip Modules

International Conference and Exhibition on Multichip Modules (5th 1996 Denver, Colo.)

1996422 pp.
Multichip modulesInternational Conference and Exhibition on Multichip Modules. (2nd 1993 Denver, Colo.)
⏱ 9h 55m

Multichip modules

International Conference and Exhibition on Multichip Modules. (2nd 1993 Denver, Colo.)

1993595 pp.
Materials for high-density electronic packaging and interconnectionNational Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.
⏱ 2h 19m

Materials for high-density electronic packaging and interconnection

National Research Council (U.S.). Committee on Materials for High-Density Electronic Packaging.

1990139 pp.
ProceedingsInternational Conference on High Density Packaging and MCMs (1999 Denver, Colo.)
⏱ 7h 36m

Proceedings

International Conference on High Density Packaging and MCMs (1999 Denver, Colo.)

1999456 pp.
Microelectronics technologyElsa Reichmanis
⏱ 9h 37m

Microelectronics technology

Elsa Reichmanis

1995577 pp.
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