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J
John H. Lau
25 books found
Books by John H. Lau
Semiconductor Advanced Packaging
John H. Lau
⏱ 6h 32m
Semiconductor Advanced Packaging
John H. Lau
2021
392 pp.
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
⏱ 9h 7m
Chiplet Design and Heterogeneous Integration Packaging
John H. Lau
2023
547 pp.
Fan-Out Wafer-Level Packaging
John H. Lau
⏱ 5h 23m
Fan-Out Wafer-Level Packaging
John H. Lau
2018
323 pp.
Solder joint reliability
John H. Lau
⏱ 10h 42m
Solder joint reliability
John H. Lau
1991
642 pp.
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
John H. Lau
⏱ 6h 48m
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies
John H. Lau
1997
408 pp.
Flip chip technologies
John H. Lau
⏱ 9h 25m
Flip chip technologies
John H. Lau
1996
565 pp.
Handbook of tape automated bonding
John H. Lau
⏱ 10h 45m
Handbook of tape automated bonding
John H. Lau
1992
645 pp.
Solder Joint Reliability
John H. Lau
⏱ 31m
Solder Joint Reliability
John H. Lau
1991
31 pp.
Heterogeneous Integrations
John H. Lau
⏱ 3h 32m
Heterogeneous Integrations
John H. Lau
2019
212 pp.
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
John H. Lau
⏱ 9h 45m
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies
John H. Lau
2000
585 pp.
Electronic packaging
John H. Lau
⏱ 8h 16m
Electronic packaging
John H. Lau
1998
496 pp.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology
John H. Lau
2024
No page data
Thermal stress and strain in microelectronics packaging
John H. Lau
⏱ 14h 43m
Thermal stress and strain in microelectronics packaging
John H. Lau
1993
883 pp.
Ball Grid Array Technology
John H. Lau
⏱ 10h 36m
Ball Grid Array Technology
John H. Lau
1995
636 pp.
Handbook of fine pitch surface mount technology
John H. Lau
⏱ 11h 32m
Handbook of fine pitch surface mount technology
John H. Lau
1994
692 pp.
Advanced MEMS packaging
John H. Lau
⏱ 9h 36m
Advanced MEMS packaging
John H. Lau
2010
576 pp.
Chip on board technologies for multichip modules
John H. Lau
⏱ 9h 15m
Chip on board technologies for multichip modules
John H. Lau
1994
555 pp.
Reliability Of Rohscompliant 2d And 3d Ic Interconnects
John H. Lau
⏱ 10h 40m
Reliability Of Rohscompliant 2d And 3d Ic Interconnects
John H. Lau
2010
640 pp.
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
John H. Lau
⏱ 11h 32m
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)
John H. Lau
1993
692 pp.
Chip On Board
John H. Lau
⏱ 9h 15m
Chip On Board
John H. Lau
1994
555 pp.