J

John H. Lau

25 books found

Books by John H. Lau
Semiconductor Advanced PackagingJohn H. Lau
⏱ 6h 32m

Semiconductor Advanced Packaging

John H. Lau

2021392 pp.
Chiplet Design and Heterogeneous Integration PackagingJohn H. Lau
⏱ 9h 7m

Chiplet Design and Heterogeneous Integration Packaging

John H. Lau

2023547 pp.
Fan-Out Wafer-Level PackagingJohn H. Lau
⏱ 5h 23m

Fan-Out Wafer-Level Packaging

John H. Lau

2018323 pp.
Solder joint reliabilityJohn H. Lau
⏱ 10h 42m

Solder joint reliability

John H. Lau

1991642 pp.
Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assembliesJohn H. Lau
⏱ 6h 48m

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies

John H. Lau

1997408 pp.
Flip chip technologiesJohn H. Lau
⏱ 9h 25m

Flip chip technologies

John H. Lau

1996565 pp.
Handbook of tape automated bondingJohn H. Lau
⏱ 10h 45m

Handbook of tape automated bonding

John H. Lau

1992645 pp.
Solder Joint ReliabilityJohn H. Lau
⏱ 31m

Solder Joint Reliability

John H. Lau

199131 pp.
Heterogeneous IntegrationsJohn H. Lau
⏱ 3h 32m

Heterogeneous Integrations

John H. Lau

2019212 pp.
Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA AssembliesJohn H. Lau
⏱ 9h 45m

Low Cost Flip Chip Technologies for DCA, WLCSP, and PBGA Assemblies

John H. Lau

2000585 pp.
Electronic packagingJohn H. Lau
⏱ 8h 16m

Electronic packaging

John H. Lau

1998496 pp.
Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out TechnologyJohn H. Lau

Flip Chip, Hybrid Bonding, Fan-In, and Fan-Out Technology

John H. Lau

2024No page data
Thermal stress and strain in microelectronics packagingJohn H. Lau
⏱ 14h 43m

Thermal stress and strain in microelectronics packaging

John H. Lau

1993883 pp.
Ball Grid Array TechnologyJohn H. Lau
⏱ 10h 36m

Ball Grid Array Technology

John H. Lau

1995636 pp.
Handbook of fine pitch surface mount technologyJohn H. Lau
⏱ 11h 32m

Handbook of fine pitch surface mount technology

John H. Lau

1994692 pp.
Advanced MEMS packagingJohn H. Lau
⏱ 9h 36m

Advanced MEMS packaging

John H. Lau

2010576 pp.
Chip on board technologies for multichip modulesJohn H. Lau
⏱ 9h 15m

Chip on board technologies for multichip modules

John H. Lau

1994555 pp.
Reliability Of Rohscompliant 2d And 3d Ic InterconnectsJohn H. Lau
⏱ 10h 40m

Reliability Of Rohscompliant 2d And 3d Ic Interconnects

John H. Lau

2010640 pp.
Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)John H. Lau
⏱ 11h 32m

Handbook Of Fine Pitch Surface Mount Technology (Electrical Engineering)

John H. Lau

1993692 pp.
Chip On BoardJohn H. Lau
⏱ 9h 15m

Chip On Board

John H. Lau

1994555 pp.